Published November 3, 2008 | Version v1
Journal article

Reliability degradation of thin HfO2/SiO2 gate stacks by remote RF hydrogen and deuterium plasma treatment

  • 1. Centre of Electronic Materials, Devices and Nanostructures, University of Manchester, Manchester M60 1QD (United Kingdom)
  • 2. School of Engineering, Liverpool John Moores University, Byrom Street, Liverpool L3 3AF (United Kingdom)
  • 3. CNR-INFM MDM National Laboratory, Via C. Olivetti 2, 20041, Agrate Brianza, Milan (Italy)

Description

Current-voltage measurements indicated that RF hydrogen/deuterium remote plasma treatment of thin p-Si/SiO2/HfO2 structures proved to be detrimental in terms of dielectric reliability. By using capacitance-voltage measurements we demonstrate that this reported degradation was not attributed to plasma-induced defects but rather due to an enhanced liberation of hydrogen and deuterium species during the electrical stress

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2008.08.051

Additional details

Identifiers

DOI
10.1016/j.tsf.2008.08.051;
PII
S0040-6090(08)00904-8;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
517
Journal Issue
1
Journal Page Range
p. 207-208
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
5. International conference on silicon epitaxy and heterostructures
Acronym
ICSI-5
Dates
20-24 May 2007
Place
Marseille (France)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
40058995
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
DEUTERIUM; DIELECTRIC MATERIALS; HAFNIUM OXIDES; HYDROGEN; PLASMA; SILICON; SILICON OXIDES; STACKS; STRESSES
Descriptors DEC
CHALCOGENIDES; ELEMENTS; HAFNIUM COMPOUNDS; HYDROGEN ISOTOPES; ISOTOPES; LIGHT NUCLEI; MATERIALS; NONMETALS; NUCLEI; ODD-ODD NUCLEI; OXIDES; OXYGEN COMPOUNDS; REFRACTORY METAL COMPOUNDS; SEMIMETALS; SILICON COMPOUNDS; STABLE ISOTOPES; TRANSITION ELEMENT COMPOUNDS

Optional Information

Copyright
Copyright (c) 2008 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.