Published February 2008 | Version v1
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Counting and integrating microelectronics development for direct conversion X-ray imaging

Description

A novel signal processing concept for X-ray imaging with directly converting pixelated semiconductor sensors is presented. The novelty of this approach compared to existing concepts is the combination of charge integration and photon counting in every single pixel. Simultaneous operation of both signal processing chains extends the dynamic range beyond the limits of the individual schemes and allows determination of the mean photon energy. Medical applications such as X-ray computed tomography can benefit from this additional spectral information through improved contrast and the ability to determine the hardening of the tube spectrum due to attenuation by the scanned object. A prototype chip in 0.35-micrometer technology has been successfully tested. The pixel electronics are designed using a low-swing differential current mode logic. Key element is a configurable feedback circuit for the charge sensitive amplifier which provides continuous reset, leakage current compensation and replicates the input signal for the integrator. The thesis focusses on the electronic characterization of a second generation prototype chip and gives a detailed discussion of the circuit design. (orig.)

Availability note (English)

Available from INIS in electronic form

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Additional details

Publishing Information

Imprint Pagination
149 p.
ISSN
0172-8741
Report number
BONN-IR--2008-01