Published October 2013 | Version v1
Journal article

The optimal design of 15 nm gate-length junctionless SOI FinFETs for reducing leakage current

  • 1. School of Information Science and Engineering, Shenyang University of Technology, Shenyang 110870 (China)
  • 2. School of EECS, Kyungpook National University, 1370 Sangyuk-Dong Buk-Gu, Daegu 702-701 (Korea, Republic of)
  • 3. School of EECS Engineering and ISRC (Inter-University Semiconductor Research Center), Seoul National University, Shinlim-Dong, Kwanak-Gu, Seoul 151-742 (Korea, Republic of)

Description

Junctionless (JL) transistors need to be heavily doped to have large drain current in the ON-state, which engenders the effect of band-to-band tunneling (BTBT) in the OFF-state simultaneously. It causes an obvious increase of the leakage current in the OFF-state. This paper presents an effective method of reducing the leakage current by changing the geometrical shape and dimension of the oxide layer under the edge of the gate. The optimal design of 15 nm gate-length JL silicon-on-insulator FinFETs with the triple-gate structure is performed for reducing the effect of BTBT through simulation and analysis by this means. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0268-1242/28/10/105013

Additional details

Publishing Information

Journal Title
Semiconductor Science and Technology
Journal Volume
28
Journal Issue
10
Journal Page Range
[6 p.]
ISSN
0268-1242
CODEN
SSTEET

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
45013870
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
DESIGN; DOPED MATERIALS; LAYERS; LEAKAGE CURRENT; SIMULATION; TRANSISTORS; TUNNEL EFFECT
Descriptors DEC
CURRENTS; ELECTRIC CURRENTS; MATERIALS; SEMICONDUCTOR DEVICES