Published December 2, 2013 | Version v1
Journal article

Comparison of neat and photo-crosslinked polyvinylidene fluoride-co-hexafluoropropylene thin film dielectrics formed by spin-coating

  • 1. Materials Science and Engineering Department, The University of Texas at Dallas, Richardson, TX 75080 (United States)
  • 2. Electrical Engineering Department, The University of Texas at Tyler, Tyler, TX 75799 (United States)

Description

We report the characterization of photo-crosslinked polyvinylidene fluoride-co-hexafluoropropylene (PVDF-HFP) thin film, metal–insulator–metal capacitors fabricated using standard semiconductor processing techniques. We characterize the capacitors using in-situ vibrational spectroscopy during thermally-assisted poling and correlate the Fourier transform infrared spectroscopy (FTIR) results with X-ray diffraction (XRD) results. FTIR analysis of the neat PVDF-HFP showed α → β transformations during poling at room temperature and at 55 °C. α → β transformations were observed for the crosslinked polymer only during poling at 55 °C. XRD data revealed that photo-crosslinking caused the polymer to partially crystallize into the β-phase. The similar behavior of the neat and crosslinked samples at 55 °C suggests that a higher activation energy was needed for α → β transformations in crosslinked PVDF-HFP during poling. Electrical measurements showed that photo-crosslinking had no significant effect on the dielectric constant and dielectric loss of PVDF-HFP. However, the dielectric strength and maximum energy density of the crosslinked polymer were severely reduced. - Highlights: • Polyvinylidene fluoride-hexafluoropropylene (PVDF-HFP) dielectrics were studied. • Phase transformations were observed only at 55 °C for the crosslinked PVDF-HFP. • Crosslinking had no strong effect on the dielectric constant of PVDF-HFP. • Breakdown strengths were 620 MVm−1 and 362 MVm−1 for neat and crosslinked films

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2013.09.062

Additional details

Identifiers

DOI
10.1016/j.tsf.2013.09.062;
PII
S0040-6090(13)01534-4;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
548
Journal Page Range
p. 597-602
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.