Published December 2005 | Version v1
Journal article

A size effect in grain boundary migration: A molecular dynamics study of bicrystal thin films

  • 1. School of Materials Science and Engineering, Nanchang University, 235 East Nanjing Road, Nanchang, Jiangxi 330047 (China) and Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540 (United States)
  • 2. Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540 (United States)

Description

Molecular dynamics simulations of stress-driven grain boundary migration in bicrystal thin films demonstrate that the grain boundary mobility decreases as the films are made thinner. Examination of the surface morphology proves that this effect is not associated with grain boundary grooving. The simulation data demonstrate that the grain boundary mobility is a linear function of the inverse thickness. We present a simple model to explain this effect based upon the fundamental mechanism of grain boundary migration: the collective rearrangement of a large group of atoms. Decreasing system size implies that more of the boundary is near the surface. The presence of the free surface interferes with the collective rearrangement of the atoms during boundary motion and hence slows the migration. A simple heuristic analysis, based on this effect, is consistent with the observed functional dependence of boundary mobility on bicrystal thickness

Additional details

Identifiers

DOI
10.1016/j.actamat.2005.07.032;
PII
S1359-6454(05)00463-5;

Publishing Information

Journal Title
Acta Materialia
Journal Volume
53
Journal Issue
20
Journal Page Range
p. 5273-5279
ISSN
1359-6454
CODEN
ACMAFD

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37055917
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
GRAIN BOUNDARIES; MIGRATION; MOBILITY; MOLECULAR DYNAMICS METHOD; MORPHOLOGY; NANOSTRUCTURES; SIMULATION; STRESSES; SURFACES; THICKNESS; THIN FILMS
Descriptors DEC
CALCULATION METHODS; DIMENSIONS; FILMS; MICROSTRUCTURE

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.