A size effect in grain boundary migration: A molecular dynamics study of bicrystal thin films
Creators
- 1. School of Materials Science and Engineering, Nanchang University, 235 East Nanjing Road, Nanchang, Jiangxi 330047 (China) and Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540 (United States)
- 2. Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, NJ 08540 (United States)
Description
Molecular dynamics simulations of stress-driven grain boundary migration in bicrystal thin films demonstrate that the grain boundary mobility decreases as the films are made thinner. Examination of the surface morphology proves that this effect is not associated with grain boundary grooving. The simulation data demonstrate that the grain boundary mobility is a linear function of the inverse thickness. We present a simple model to explain this effect based upon the fundamental mechanism of grain boundary migration: the collective rearrangement of a large group of atoms. Decreasing system size implies that more of the boundary is near the surface. The presence of the free surface interferes with the collective rearrangement of the atoms during boundary motion and hence slows the migration. A simple heuristic analysis, based on this effect, is consistent with the observed functional dependence of boundary mobility on bicrystal thickness
Additional details
Identifiers
- DOI
- 10.1016/j.actamat.2005.07.032;
- PII
- S1359-6454(05)00463-5;
Publishing Information
- Journal Title
- Acta Materialia
- Journal Volume
- 53
- Journal Issue
- 20
- Journal Page Range
- p. 5273-5279
- ISSN
- 1359-6454
- CODEN
- ACMAFD
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 37055917
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- GRAIN BOUNDARIES; MIGRATION; MOBILITY; MOLECULAR DYNAMICS METHOD; MORPHOLOGY; NANOSTRUCTURES; SIMULATION; STRESSES; SURFACES; THICKNESS; THIN FILMS
- Descriptors DEC
- CALCULATION METHODS; DIMENSIONS; FILMS; MICROSTRUCTURE
Optional Information
- Copyright
- Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.