Evaluation of microindentation properties of epitaxial 3C–SiC/Si thin films

The microhardness characteristics of 3C–SiC/Si films grown by vapor phase epitaxy were investigated using Vickers and Knoop indenters. The observed hardness behavior at lower load range is being attributed to indentation size effect while the substrate hardness effect is found to be prominent at higher loads. The related mechanical properties such as fracture toughness, brittleness index, and yield stress were also evaluated. In order to study the nature and behavior of the surface topography during the deformation process for the applied load, detailed atomic force microscopy images were obtained around the indented regions of the samples. It revealed that the indents formed at higher loads showed fracture characteristics with a pattern of radial cracks propagating from the indent corners.