Published January 10, 2005 | Version v1
Journal article

Laser bending for high-precision curvature adjustment of microcantilevers

  • 1. School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47907 (United States)

Description

This work describes a laser based technique to adjust curvatures of silicon microcantilevers used for chemical and biological detection. In batch fabricated silicon cantilever arrays used for parallel sensing, it is often desirable that all cantilevers have nearly identical curvatures or flatness. We demonstrate that using the laser technique, it is possible to adjust curvatures by an amount as small as 3.5 μrad, for cantilevers with a typical dimension of 110x13x0.6 μm (lengthxwidthxthickness). Different laser parameters can be applied in order to achieve the required curvature adjustment. A two-dimensional finite element model of laser curvature adjustment is presented which enables the prediction of the laser processing parameters

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
86
Journal Issue
2
Journal Page Range
p. 021114-021114.3
ISSN
0003-6951
CODEN
APPLAB

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
36080256
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ACCURACY; BENDING; FINITE ELEMENT METHOD; LASER MATERIALS; LASERS; PROCESSING; SEMICONDUCTOR MATERIALS; SILICON; STRESSES; TWO-DIMENSIONAL CALCULATIONS
Descriptors DEC
CALCULATION METHODS; DEFORMATION; ELEMENTS; MATERIALS; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; SEMIMETALS

Optional Information

Notes
(c) 2005 American Institute of Physics