Published January 10, 2005
| Version v1
Journal article
Laser bending for high-precision curvature adjustment of microcantilevers
Creators
- 1. School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47907 (United States)
Description
This work describes a laser based technique to adjust curvatures of silicon microcantilevers used for chemical and biological detection. In batch fabricated silicon cantilever arrays used for parallel sensing, it is often desirable that all cantilevers have nearly identical curvatures or flatness. We demonstrate that using the laser technique, it is possible to adjust curvatures by an amount as small as 3.5 μrad, for cantilevers with a typical dimension of 110x13x0.6 μm (lengthxwidthxthickness). Different laser parameters can be applied in order to achieve the required curvature adjustment. A two-dimensional finite element model of laser curvature adjustment is presented which enables the prediction of the laser processing parameters
Additional details
Identifiers
- DOI
- 10.1063/1.1851617;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 86
- Journal Issue
- 2
- Journal Page Range
- p. 021114-021114.3
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 36080256
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- ACCURACY; BENDING; FINITE ELEMENT METHOD; LASER MATERIALS; LASERS; PROCESSING; SEMICONDUCTOR MATERIALS; SILICON; STRESSES; TWO-DIMENSIONAL CALCULATIONS
- Descriptors DEC
- CALCULATION METHODS; DEFORMATION; ELEMENTS; MATERIALS; MATHEMATICAL SOLUTIONS; NUMERICAL SOLUTION; SEMIMETALS
Optional Information
- Notes
- (c) 2005 American Institute of Physics