Published October 2020 | Version v1
Journal article

Bond-length mapping without two-dimensional scanning by means of photoemission electron microscopy-extended X-ray absorption fine structure measurement

  • 1. Gunma University, Graduate School of Science and Technology, Kiryu, Gunma (Japan)
  • 2. High Energy Accelerator Research Organization, Institute of Materials Structure Science, Tsukuba, Ibaraki (Japan)

Description

We develop a bond-length mapping technique without two-dimensional scanning by combining photoelectron emission microscopy with extended X-ray absorption fine structure (EXAFS) analysis. Several tens of thousands of EXAFS data are simultaneously acquired, which corresponds to a data acquisition time less than 1 second per spectrum. We apply this technique to an Fe/BaTiO3 thin film, and two-dimensional distribution of the Fe-Fe bond length at the Fe surface is observed. >From the Fe K-edge EXAFS analysis, we find that the Fe-Fe bond length is ∼2.52 Å over the whole area with a Gaussian distribution of ∼0.01 Å, which implies that this technique realizes a bond-length mapping with precise bond-length determination. (author)

Availability note (English)

Available from DOI: https://doi.org/10.35848/1347-4065/abb716

Additional details

Identifiers

Publishing Information

Journal Title
Japanese Journal of Applied Physics (Online)
Journal Volume
59
Journal Issue
10
Journal Page Range
p. 105504.1-105504.6
ISSN
1347-4065

Optional Information

Notes
33 refs., 6 figs., 1 tab.