Published November 29, 2013 | Version v1
Journal article

Effect of thickness and substrate temperature on the properties of transparent Ti-doped In2O3 films grown by direct current magnetron sputtering

  • 1. Department of Advanced Materials Engineering for Information and Electronics, Kyung-Hee University, 1 Seocheon-dong, Yongin-si, Gyeonggi-do 446-701 (Korea, Republic of)
  • 2. Z-TEC Co., Ltd., Star-Biz Building #105, 4th Gumi National Industrial Complex, Sandong-myeon, Gumi-si, Gyeongsanbuk-do, 730-853 (Korea, Republic of)

Description

We reported on the effect of film thickness and substrate temperature on the properties of TiO2-doped In2O3 (TIO) films deposited on a glass substrate by direct current (DC) magnetron sputtering for touch panel applications. The electrical, optical, surface and structural properties of TIO films grown at room temperature were significantly dependent on its thickness. At optimized TIO thickness (480 nm), the resistivity of the TIO film decreased with increasing substrate temperature due to effective activation of Ti dopant and crystallization of the In2O3 matrix. Furthermore, the increase in substrate temperature during DC sputtering leads to increase of optical bandgap of the TIO films due to Burstein–Moss effect, which is caused by change in carrier concentration of TIO films. At optimized conditions, the TIO film shows resistivity of 1.947 × 10−4 Ω-cm and optical transmittance of 85.3% comparable conventional indium tin oxide films. - Highlights: • Thickness effect on the properties of Ti-doped In2O3 (TIO) films was investigated. • TIO film properties were correlated with thickness and substrate temperature. • The optical band-gap of the TIO films due to Burstein–Moss effect was investigated

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2013.02.073

Additional details

Identifiers

DOI
10.1016/j.tsf.2013.02.073;
PII
S0040-6090(13)00343-X;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
547
Journal Page Range
p. 225-229
ISSN
0040-6090
CODEN
THSFAP

Conference

Title
4. international conference on microelectronics and plasma technology
Acronym
ICMAP 2012
Dates
4-7 Jul 2012
Place
Jeju (Korea, Republic of)

Optional Information

Copyright
Copyright (c) 2013 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.