Main Effects of Plating Parameters on Mechanical and Surface Properties of Electroplated Copper

Electroplated copper has been used as wiring in electronic circuit boards and as cathode materials for secondary batteries, and its usage has expanded into the construction industry because of its convenient production and high economic value. During the electroplating process, various parameters, such as crystal phase and size, can affect its mechanical properties and surface characteristics. Electroplating parameters were applied with the Taguchi experimental design method, and the electroplated copper layer was analyzed to observe changes in properties with various parameters. Among the parameters, current density significantly affected mechanical properties such as tensile strength and elongation. The size of the crystal grain decreased with the current density, which resulted in a 47% increase in tensile strength. Tensile strength and elongation tended to decrease when SPS(bis(3-sulfopropyl)disulfide)) was added as additives, and high elongation was observed when the hydroxyethyl cellulose(HEC)/SPS ratio was three times or more. When the concentration of sulfuric acid was high, the strongly preferred direction of crystal growth was parallel to the (111) plane.