Analysis of macro channel heat exchanger for fever relief cool cap using thermoelectric
Creators
- 1. School of Mechatronic Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, 02600 Arau, Perlis Malaysia (Malaysia)
- 2. Faculty of Technology, University of Sunderland, St Peter's Campus, Sunderland, SR6 0DD (United Kingdom)
- 3. School of Microelectronic Engineering, Universiti Malaysia Perlis, Pauh Putra Campus, 02600 Arau, Perlis Malaysia (Malaysia)
Description
Fever is happened when the human having infection or other illness which the body temperature is higher than normal body temperature. The heat load released during the fever cause the uncomfortable condition to the human. Thermoelectric is used in the design of heat exchanger to provide cooling by using electricity which reliefs the fever uncomfortable. The thermal comfort zone for human and the analysis of the heat load from the human head surface are determined. The analysis focuses on the fever teenagers aged range from 15 to 25. The range of the thermal comfort zone is from 20 °C to 25 °C whereas the range for the total heat load from the head surface is from 10.56 W to 16.39 W. The findings from the analysis will be used in the design of heat exchanger that suites the requirement from the analysis result. The fluid flow effect of the working fluid and thermal effect of the heat exchanger are simulated by ANSYS Fluent. In addition, the different types of Peltier plate and fluid as well as the different materials of heat exchanger and tube have applied into heat exchanger design model for observing the effect of the fluid flow in heat exchanger. Using ANSYS Fluent, the temperature contours are compared and found that the combination of alumina Al2O3 nanofluid, copper heat exchanger have better performance due to high heat transfer rate while the tube materials show no effect. The best performance of cooling in the design of the heat exchanger is proposed. These design criteria include the selection of the material of heat exchanger, tube and fluid as well as the selection of the device such as Peltier plate, battery, cooler fan and pump. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/1757-899X/670/1/012040Additional details
Identifiers
Publishing Information
- Journal Title
- IOP Conference Series. Materials Science and Engineering (Online)
- Journal Volume
- 670
- Journal Issue
- 1
- Journal Page Range
- [6 p.]
- ISSN
- 1757-899X
Conference
- Title
- 6. International Conference on Applications and Design in Mechanical Engineering
- Dates
- 26-27 Aug 2019
- Place
- Penang (Malaysia)
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 54075778
- Subject category
- S36: MATERIALS SCIENCE; S42: ENGINEERING;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ALUMINIUM OXIDES; COMPUTERIZED SIMULATION; COPPER; DESIGN; FLUID FLOW; HEAT; HEAT EXCHANGERS; HEAT TRANSFER; HEATING LOAD; MATERIALS; NANOFLUIDS; PERFORMANCE; PLATES; SURFACES; TEMPERATURE DEPENDENCE; THERMAL COMFORT; WORKING FLUIDS
- Descriptors DEC
- ALUMINIUM COMPOUNDS; CHALCOGENIDES; DISPERSIONS; ELEMENTS; ENERGY; ENERGY TRANSFER; FLUIDS; METALS; OXIDES; OXYGEN COMPOUNDS; SIMULATION; SUSPENSIONS; TRANSITION ELEMENTS