Published June 15, 2007 | Version v1
Journal article Metadata-only

Thermal properties of VPS-W coatings on CuCrZr alloy with Ti bonding layer

Creators

  • 1. School of Materials Science and Engineering, P.O. Box 541, Hefei University of Technology, Anhui Province, Hefei 230009 (China)
  • 2. Institute of Plasma Physics, Chinese Academy of Sciences, Hefei 230031 (China)

Description

Tungsten coating of 0.2 mm thickness was successfully deposited by vacuum plasma spraying technique on CuCrZr alloy with Ti bonding layer. Microstructure and chemical composition of deposited W were examined. Its thermal response and thermal fatigue properties were studied with active cooling. No cracks and no exfoliation occurred on the W surface after thermal response test with a heat flux from 0 to 8 MW/m2. It survived up to 200 cycles under 8 MW/m2. These results indicate that VPS-W coated Ti/CuCrZr is a potential candidate for a high heat resistance armor material on plasma facing components

Additional details

Identifiers

DOI
10.1016/j.jnucmat.2007.01.249;
PII
S0022-3115(07)00262-0;

Publishing Information

Journal Title
Journal of Nuclear Materials
Journal Volume
363-365
Journal Page Range
p. 1294-1298
ISSN
0022-3115
CODEN
JNUMAM

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
39009945
Subject category
S36: MATERIALS SCIENCE; S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Descriptors DEI
CHEMICAL COMPOSITION; CHROMIUM ALLOYS; COPPER ALLOYS; FIRST WALL; HEAT FLUX; HEATING LOAD; HT-7U TOKAMAK; LAYERS; MICROSTRUCTURE; PLASMA; SPRAY COATING; SPRAYED COATINGS; SURFACES; THERMAL FATIGUE; THERMODYNAMIC PROPERTIES; TUNGSTEN; ZIRCONIUM ALLOYS
Descriptors DEC
ALLOYS; CLOSED PLASMA DEVICES; COATINGS; DEPOSITION; ELEMENTS; FATIGUE; MECHANICAL PROPERTIES; METALS; PHYSICAL PROPERTIES; REFRACTORY METALS; SURFACE COATING; THERMONUCLEAR DEVICES; THERMONUCLEAR REACTOR WALLS; TOKAMAK DEVICES; TRANSITION ELEMENT ALLOYS; TRANSITION ELEMENTS

Optional Information

Copyright
Copyright (c) 2007 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.