Published February 2010 | Version v1
Journal article

Degradation of AlGaN/GaN High Electron Mobility Transistors with Different AlGaN Layer Thicknesses under Strong Electric Field

  • 1. Key Laboratory of Wide Band Gap Semiconductor Material and Device, Institute of Microelectronics, Xidian University, Xi'an 710071 (China)
  • 2. Key Laboratory of Intelligent Perception and Image Understanding (Ministry of Education), Institute of Intelligent Information Processing, Xidian University, Xi'an 710071 (China)
  • 3. National Key Laboratory of Science and Technology on Antennas and Microwaves, Xidian University, Xi'an 710071 (China)

Description

The degradation of AlGaN/GaN high electron mobility transistors (HEMTs) has a close relationship with a model of traps in AlGaN barriers as a result of high electric field. We mainly discuss the impacts of strong electrical field on the AlGaN barrier thickness of AlGaN/GaN HEMTs. It is found that the device with a thin AlGaN barrier layer is more easily degraded. We study the degradation of four parameters, i.e. the gate series resistance RGate, channel resistance Rchannel, gate current IG,off at VGS = −5 and VDS = 0.1 V, and drain current ID,max at VGS = 2 and VDS = 5 V. In addition, the degradation mechanisms of the device electrical parameters are also investigated in detail. (condensed matter: electronic structure, electrical, magnetic, and optical properties)

Availability note (English)

Available from http://dx.doi.org/10.1088/0256-307X/27/2/027102

Additional details

Publishing Information

Journal Title
Chinese Physics Letters
Journal Volume
27
Journal Issue
2
Journal Page Range
[3 p.]
ISSN
0256-307X
CODEN
CPLEEU