Published July 15, 2009 | Version v1
Journal article

Experimental and atomistic simulation studies of corrosion inhibition of copper by a new benzotriazole derivative in acid medium

Creators

  • 1. Electrochemistry Research Laboratory, Chemistry Department, Ain Shams University, Roxy, Cairo 11711 (Egypt)

Description

The efficiency of N-(2-thiazolyl)-1H-benzotriazole-1-carbothioamide (TBC) as a non-toxic corrosion inhibitor for copper in 0.5 M HCl has been tested by weight loss and electrochemical techniques. Electrochemical techniques show that TBC is a mixed-type inhibitor and its inhibition mechanism on copper surface is adsorption assisted by H-bond formation. Impedance measurements show a wide peak presumably given by more than one time constant in the presence of TBC. Also, impedance results show that the values of CPEs (constant phase elements) tend to decrease and both polarization resistance and inhibition efficiency tend to increase with increasing of TBC concentration due to an increase in the electric double layer. Monte Carlo simulations incorporating molecular mechanics and molecular dynamics show that the TBC adsorb on the copper surface firmly through the thiazolyl and carbothioamide groups, the adsorption energy as well as hydrogen bond length have been calculated for both TBC and benzotriazole (BTA) for comparison. Quantum chemical calculations reveal that TBC has higher HOMO, lower LUMO, lower energy gap and lower dipole moment (μ) than BTA, which proves that TBC is better copper corrosion inhibitor compared with BTA in 0.5 M HCl.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.electacta.2009.03.002

Additional details

Identifiers

DOI
10.1016/j.electacta.2009.03.002;
PII
S0013-4686(09)00373-9;

Publishing Information

Journal Title
Electrochimica Acta
Journal Volume
54
Journal Issue
18
Journal Page Range
p. 4345-4352
ISSN
0013-4686
CODEN
ELCAAV

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.