Published February 15, 2010 | Version v1
Journal article

Microstructure and mechanical properties of nanoscale Cu/Ni multilayers

  • 1. National Key Lab for Remanufacturing, Academy of Armored Forces Engineering, Beijing 100072 (China)
  • 2. Laboratory of Advanced Materials, Department of Materials Science and Engineering, Tsinghua University, Beijing 100084 (China)

Description

The microstructure, hardness and creep behavior of Cu/Ni multilayers were investigated by X-ray diffraction, transmission electron microscopy and nanoindentation. The results show that the multilayers with a good modulation structure formed coherent superlattice at low periodicity. The strength increases as the periodicity falls from 17.5 nm to 7.0 nm, which can be well described by a CLS model. After that, the strength reaches a peak value of 2.53 GPa at the smallest periodicity of 3.5 nm. This value approximately equals to the theoretical peak strength predicted by a coherent stresses model. The stress exponent extracted from nanoindentation creep test varies from 2.20 to 6.87, indicating a dislocation glide-climb creep mechanism. The variation in the stress exponent with decreasing periodicity is discussed and ascribed to a change of the dominating rate from climb-controlled to eventually glide-controlled events.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2009.09.058

Additional details

Identifiers

DOI
10.1016/j.msea.2009.09.058;
PII
S0921-5093(09)01107-1;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
527
Journal Issue
4-5
Journal Page Range
p. 1243-1248
ISSN
0921-5093
CODEN
MSAPE3

Optional Information

Copyright
Copyright (c) 2009 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.