Published February 2019 | Version v1
Journal article

Dynamic interactions between non-screw dislocations and stacking faults during in situ straining in a TEM

  • 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072 (China)
  • 2. College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016 (China)

Description

Highlights: • The interaction between non-screw dislocations and stacking faults were revealed in situ in a transmission electron microscope at the atomic scale. • Stacking faults impinged by lattice dislocations tend to shrink to form stair-rod dislocations. • Twin embryo can be generated due to the interaction between an intrinsic stacking fault with a lattice dislocation. -- Abstract: The atomic-scale evolution routes of stacking faults (SFs) interacting with non-screw dislocations were revealed by in situ tensile tests on Cu. SFs impinged by lattice dislocations tend to shrink to form stair-rod dislocations which may either be stable or unstable, depending on the dislocation reactions. Also, stacking fault can transform from intrinsic to extrinsic, which provides a new route of twin nucleation in face-centered cubic metals.

Additional details

Identifiers

DOI
10.1016/j.matchar.2019.01.004;
PII
S1044580318333035;

Publishing Information

Journal Title
Materials Characterization
Journal Volume
148
Journal Page Range
p. 292-296
ISSN
1044-5803
CODEN
MACHEX

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
55031072
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
DEFORMATION; FCC LATTICES; METALS; NUCLEATION; SCREW DISLOCATIONS; STACKING FAULTS; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
CRYSTAL DEFECTS; CRYSTAL LATTICES; CRYSTAL STRUCTURE; CUBIC LATTICES; DISLOCATIONS; ELECTRON MICROSCOPY; ELEMENTS; LINE DEFECTS; MICROSCOPY; THREE-DIMENSIONAL LATTICES

Optional Information

Copyright
Copyright (c) 2019 Elsevier Inc. All rights reserved.