Published March 2009
| Version v1
Journal article
Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections
Creators
- 1. DTU Nanotech, Department of Micro- and Nanotechnology, Technical University of Denmark (DTU), Ørsteds Plads, Bygning 345Ø, DK-2800, Køngens Lyngby (Denmark)
Description
In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/19/3/035021Additional details
Identifiers
- DOI
- 10.1088/0960-1317/19/3/035021;
- PII
- S0960-1317(09)01928-7;
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 19
- Journal Issue
- 3
- Journal Page Range
- [9 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 44099367
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- DENSITY; FLEXIBILITY; FLUIDIC DEVICES; POLYMERS; SILOXANES; TESTING
- Descriptors DEC
- MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC SILICON COMPOUNDS; PHYSICAL PROPERTIES; TENSILE PROPERTIES