Published March 2009 | Version v1
Journal article

Interconnection blocks: a method for providing reusable, rapid, multiple, aligned and planar microfluidic interconnections

  • 1. DTU Nanotech, Department of Micro- and Nanotechnology, Technical University of Denmark (DTU), Ørsteds Plads, Bygning 345Ø, DK-2800, Køngens Lyngby (Denmark)

Description

In this paper a method is presented for creating 'interconnection blocks' that are re-usable and provide multiple, aligned and planar microfluidic interconnections. Interconnection blocks made from polydimethylsiloxane allow rapid testing of microfluidic chips and unobstructed microfluidic observation. The interconnection block method is scalable, flexible and supports high interconnection density. The average pressure limit of the interconnection block was near 5.5 bar and all individual results were well above the 2 bar threshold considered applicable to most microfluidic applications

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/19/3/035021

Additional details

Identifiers

DOI
10.1088/0960-1317/19/3/035021;
PII
S0960-1317(09)01928-7;

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
19
Journal Issue
3
Journal Page Range
[9 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
44099367
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
DENSITY; FLEXIBILITY; FLUIDIC DEVICES; POLYMERS; SILOXANES; TESTING
Descriptors DEC
MECHANICAL PROPERTIES; ORGANIC COMPOUNDS; ORGANIC SILICON COMPOUNDS; PHYSICAL PROPERTIES; TENSILE PROPERTIES