The effect of growth temperature on the nanostructure and dielectric response of BaTiO3 ferroelectric films
- 1. Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Gothenburg (Sweden)
- 2. Microwave and High Speed Electronics Research Center, Ericsson AB, SE-431 84 Moelndal (Sweden)
Description
BaTiO3 ferroelectric films were grown on Si/SiO2/Ti/Pt/Au/Pt templates at different temperatures in the range 560-680 deg. C by pulsed laser deposition. Cross section scanning electron microscopy images and atomic force microscopy surface morphology analysis reveal films with columnar structure and in-plane grain size distribution, in the range 10-60 nm, depending on growth temperature. Low-field dielectric measurements were performed as functions of temperature in the range 40-500 K and external dc field up to 400 kV/cm. The apparent permittivity of ferroelectric films grown at 680 deg. C shows Curie-Weiss behavior above 400 K with Curie temperature and Curie-Weiss constant 240 K and 1 . 105 K, respectively. The films grown at lower temperatures reveal a decrease of Curie temperature down to - 80 K, reduced values of apparent permittivity and loss tangent, and broadening of maximum of temperature dependence of apparent permittivity. The film grown at 590 deg. C demonstrates state of the art combination of temperature stability (temperature coefficient of apparent permittivity 300 ppm/K in the range 50-350 K), high tunability of apparent permittivity (up to 60% at room temperature), and relatively low loss tangent (less than 0.05 in the frequency range up to 10 GHz). The change in apparent permittivity and its temperature dependence, with variation of growth temperature are analyzed using two different composite models. The first model assumes the film to be a composite with vertical inclusions of low permittivity dielectric material associated with grain boundaries. This model may explain the observed decrease of permittivity with decreasing growth temperature, but not the shift of Curie temperature. The second model assumes a layered type of composite with low permittivity material associated with the film/electrode interfaces, and allows explanation of the Curie temperature shift
Additional details
Identifiers
- DOI
- 10.1016/j.tsf.2006.11.139;
- PII
- S0040-6090(06)01397-6;
Publishing Information
- Journal Title
- Thin Solid Films
- Journal Volume
- 515
- Journal Issue
- 16
- Journal Page Range
- p. 6302-6308
- ISSN
- 0040-6090
- CODEN
- THSFAP
Conference
- Title
- EMRS 2006 Symposium J on synthesis processing and characterization of nanoscale functional oxide films
- Dates
- 29 May - 2 Jun 2006
- Place
- Nice (France)
INIS
- Country of Publication
- Netherlands
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 39018917
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- ATOMIC FORCE MICROSCOPY; BARIUM COMPOUNDS; COMPOSITE MODELS; CROSS SECTIONS; CURIE POINT; ENERGY BEAM DEPOSITION; FERROELECTRIC MATERIALS; FILMS; GHZ RANGE 01-100; GRAIN BOUNDARIES; GRAIN SIZE; MORPHOLOGY; NANOSTRUCTURES; PERMITTIVITY; PULSED IRRADIATION; SCANNING ELECTRON MICROSCOPY; SILICON OXIDES; SURFACES; TEMPERATURE COEFFICIENT; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0013-0065 K; TEMPERATURE RANGE 0065-0273 K; TEMPERATURE RANGE 0273-0400 K; TEMPERATURE RANGE 0400-1000 K; TITANATES
- Descriptors DEC
- ALKALINE EARTH METAL COMPOUNDS; CHALCOGENIDES; DEPOSITION; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; ELECTRICAL PROPERTIES; ELECTRON MICROSCOPY; FREQUENCY RANGE; GHZ RANGE; IRRADIATION; MATERIALS; MATHEMATICAL MODELS; MICROSCOPY; MICROSTRUCTURE; OXIDES; OXYGEN COMPOUNDS; PARTICLE MODELS; PHYSICAL PROPERTIES; REACTIVITY COEFFICIENTS; SILICON COMPOUNDS; SIZE; SURFACE COATING; TEMPERATURE RANGE; THERMODYNAMIC PROPERTIES; TITANIUM COMPOUNDS; TRANSITION ELEMENT COMPOUNDS; TRANSITION TEMPERATURE
Optional Information
- Copyright
- Copyright (c) 2006 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.