Published August 1, 2008 | Version v1
Report

Diffusion bonding of beryllium to CuCrZr for ITER applications

Description

Low temperature diffusion bonding of beryllium to CuCrZr was investigated for fusion reactor applications. Hot isostatic pressing was accomplished using various metallic interlayers. Diffusion profiles suggest that titanium is effective at preventing Be-Cu intermetallics. Shear strength measurements suggest that acceptable results were obtained at temperatures as low as 540C

Availability note (English)

Available from Sandia National Laboratories (US)

Additional details

Publishing Information

Imprint Pagination
6 p.
Report number
SAND--2008-5313C

Conference

Title
Trend in welding research conference
Dates
2-6 Jun 2008
Place
Pine Mountain, GA (United States)

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
40057517
Subject category
S70: PLASMA PHYSICS AND FUSION TECHNOLOGY;
Resource subtype / Literary indicator
Conference, Non-conventional Literature
Descriptors DEI
BERYLLIUM; BONDING; COPPER; DIFFUSION; HOT PRESSING; SHEAR PROPERTIES; THERMONUCLEAR REACTORS; TITANIUM; WELDING
Descriptors DEC
ALKALINE EARTH METALS; ELEMENTS; FABRICATION; JOINING; MATERIALS WORKING; MECHANICAL PROPERTIES; METALS; PRESSING; TRANSITION ELEMENTS

Optional Information

Contract/Grant/Project number
AC04-94AL85000
Funding organization
US Department of Energy (United States)