Published July 2010
| Version v1
Journal article
Uncovering the driving force for massive spalling in the Sn-Cu/Ni system
Creators
- 1. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan (China)
Description
To identify the driving force for the massive spalling phenomenon, carefully designed experiments were carried out. Cu-doped Sn-rich solder was reacted with Ni to form first the Sn-0.6Cu/(Cu,Ni)6Sn5/Ni structure. The original Sn-0.6Cu solder was then removed and replaced with Sn-0.3Cu or with fresh Sn-0.6Cu. Swapping the solder to Sn-0.3Cu caused massive spalling of (Cu,Ni)6Sn5. The results of this study unequivocally prove that the massive spalling reported in the literature is caused by a driving force that is purely thermodynamic in nature.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2010.03.008Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2010.03.008;
- PII
- S1359-6462(10)00146-6;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 63
- Journal Issue
- 1
- Journal Page Range
- p. 47-49
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 45024294
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- COPPER; DOPED MATERIALS; INTERFACES; INTERMETALLIC COMPOUNDS; NICKEL; SOLDERING; THERMODYNAMICS; TIN
- Descriptors DEC
- ALLOYS; ELEMENTS; FABRICATION; JOINING; MATERIALS; METALS; TRANSITION ELEMENTS; WELDING
Optional Information
- Copyright
- Copyright (c) 2010 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.