Pulsed bias effect on TiO₂[Nb] films deposited by grid assisted magnetron sputtering

Applying a pulsed negative bias to the substrate is a method used to change the energy of the ions reaching the substrate surface in sputtering processes. This allows, for example, the change of the crystalline structure of the deposited film. The control of the ion energy can be achieved by setting the duty cycle, voltage and frequency of the switched power supply. In the case of TiO₂ film deposition, a higher energy favours the formation of rutile. This work shows some relationships between the substrate bias parameters and the crystalline formation in a DC triode magnetron sputtering. (author)