On the Cu–Ga system: Electromotive force measurement and thermodynamic reoptimization

Highlights: • EMF measurement of Ga activity in solid state. • A new thermodynamic description of the Cu–Ga system based on newest experimental data. • Good agreement of theoretical calculation and experiments. - Abstract: The Cu–Sn–Ga system seems to be a promising lead free solder due to properties of gallium: excellent wetting and decreasing melting temperature of Cu–Sn lead-free solder. A new experimental measurement in a solid phase as well as a new thermodynamic description of this system is presented in this work. A good agreement between calculation and available experimental data was found