Published March 15, 2004 | Version v1
Journal article

The revolution in SiGe: impact on device electronics

Description

SiGe is having a major impact in device electronics. The most mature application is the SiGe BiCMOS technology which is in production throughout the world. The areas of most rapid growth are in CMOS where SiGe is being considered for a wide variety of elements including raised S/D, poly-SiGe Gates, in buffer layers to create a tensile strained Si layer, and as the conducting channel in MODFETs

Additional details

Identifiers

DOI
10.1016/j.apsusc.2003.08.086;
PII
S0169433203010481;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
224
Journal Issue
1-4
Journal Page Range
p. 9-17
ISSN
0169-4332
CODEN
ASUSEE

Conference

Title
1. international SiGe technology and device meeting - From materials and process technology to device and circuit technology
Acronym
ISTDM 2003
Dates
15-17 Jan 2003
Place
Nagoya (Japan)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38091707
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY; S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
EQUIPMENT; GERMANIUM SILICIDES; INTEGRATED CIRCUITS; LAYERS; SEMICONDUCTOR MATERIALS; TRANSISTORS
Descriptors DEC
ELECTRONIC CIRCUITS; GERMANIUM COMPOUNDS; MATERIALS; MICROELECTRONIC CIRCUITS; SEMICONDUCTOR DEVICES; SILICIDES; SILICON COMPOUNDS

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.