Depth profiling in surfaces using TXRF

Basically three types of specimens can be applied for calibration in TXRF, namely particle-, film- or bulk-type samples. In this study 'droplet' and 'spin-drying' standards are examined and compared with a pure metal standard. A particular test procedure is recommended in order to detect faulty calibration samples. An iterative data processing technique is presented which extracts layer characteristics and - to a certain extent - depth profiles from TXRF data. Two selected examples are considered, a Fe-Ti-Fe thin layer system and an implantation profile of Ni-atoms in silicon. (author)