Published February 2015 | Version v1
Journal article

Surface morphology and deuterium retention in tungsten exposed to high flux D plasma at high temperatures

  • 1. Laboratory of Advanced Materials, School of Materials Science and Engineering, Tsinghua University, Beijing 100084 (China)
  • 2. ITER Organization, Route de Vinon-sur-Verdon-CS90046, 13067 St Paul Lez Durance Cedex (France)
  • 3. FOM Institute DIFFER-Dutch Institute for Fundamental Energy Research, Edisonbaan 14, 3439 MN Nieuwegein (Netherlands)
  • 4. Institute of Plasma Physics, Chinese Academy of Sciences, Hefei, Anhui 230031 (China)
  • 5. Science and Technology on Surface Physics and Chemistry Laboratory, Mianyang, Sichuan 621907 (China)

Description

Surface modifications and deuterium retention induced in tungsten by high fluxes (1024 m−2 s−1) low energy (38 eV) deuterium ions were studied as a function of surface temperature. Blister formation was studied by scanning electron microscopy and electron backscatter diffraction, while deuterium retention was measured by thermal desorption spectroscopy. Blisters are observed on the surface exposed at different temperatures, ranging from 493 K to 1273 K. The blister density and D retention decrease with the increasing exposure temperature. The formation of blisters at high temperatures is attributed to the high flux of D plasma. At 943 K, with the increasing fluence, there is trend to the saturation of D retention and blister density. The defects caused by plasma exposure have an important effect on the D trapping and blistering behavior. The formation of blisters has a strong relationship with slipping system of tungsten

Availability note (English)

Available from http://dx.doi.org/10.1016/j.jnucmat.2014.11.079

Additional details

Identifiers

DOI
10.1016/j.jnucmat.2014.11.079;
PII
S0022-3115(14)00882-4;

Publishing Information

Journal Title
Journal of Nuclear Materials
Journal Volume
457
Journal Page Range
p. 213-219
ISSN
0022-3115
CODEN
JNUMAM

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.