Published 1987
| Version v1
Book
A comparison of copper transmission lines and superconducting transmission lines at 77K for second level packaging
Description
With the recent discovery of a high T/sub c/ superconductor there has been a corresponding desire to find applications for this material. One new area of potential applications concerns itself with the overlap of superconducting devices and conventional semiconductor devices. This paper looks at the impact of the new high Tc materials on interconnects that are used between chips (interchip connections). In particular, this paper focuses on the dispersive effects of lossy lines (such as copper) at liquid nitrogen temperatures for several types of second level packaging
Additional details
Publishing Information
- Publisher
- Advantage Quest.
- Imprint Place
- Sunnyvale, CA (USA)
- Imprint Title
- Proceedings of a commercialization workshop on superconductors in electronics
- Journal Page Range
- p. 7.1-7.30.
Conference
- Title
- Superconductors in electronics commercialization workshop.
- Dates
- 14-15 Sep 1987.
- Place
- San Francisco, CA (USA).
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 20054566
- Subject category
- S71: CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS;
- Resource subtype / Literary indicator
- Conference
- Descriptors DEI
- COMPARATIVE EVALUATIONS; COPPER; HIGH TEMPERATURE; NITROGEN; PACKAGING; PERFORMANCE; REVIEWS; SEMICONDUCTOR DEVICES; SUPERCONDUCTING CABLES; SUPERCONDUCTING DEVICES; SUPERCONDUCTORS
- Descriptors DEC
- CABLES; CONDUCTOR DEVICES; DOCUMENT TYPES; ELECTRIC CABLES; ELECTRICAL EQUIPMENT; ELEMENTS; EQUIPMENT; EVALUATION; METALS; NONMETALS; TRANSITION ELEMENTS