Published July 27, 1993 | Version v1
Patent

Thin film superconducting LC network

Description

A thin-film superconducting LC network is described comprising (a) a dielectric substrate having first and second oppositely disposed surfaces, (b) a first thin-film superconducting conductor disposed on one of said first and second surfaces defining an inductor, the substrate having a portion between said first conductor and said second oppositely-disposed surface, said portion having a first thickness, (c) second and third thin-film superconducting conductors disposed on said first and second surfaces, respectively, said second and third conductors opposing each other and having at least another portion of the dielectric substrate therebetween to realize a capacitor, the portion of the substrate between said second and third conductors having a second thickness less than said first thickness, and (d) thin-film superconducting conductor means for interconnecting the first conductor and a preselected one of the second and third conductors, thereby interconnecting the inductor and the capacitor to realize a desired LC network

Availability note (English)

Available from Patent and Trademark Office, Box 9, Washington, DC 20232 (United States).

Additional details

Publishing Information

Imprint Pagination
[10 p.].
IPC:
Int. Cl. H03H 7/01; H01F 5/08.
IPC
Int. Cl. H03H 7/01; H01F 5/08.
Patent number
US patent document 5,231,078/A/

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
25013618
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Resource subtype / Literary indicator
Non-conventional Literature
Descriptors DEI
CAPACITORS; DESIGN; DIELECTRIC MATERIALS; FABRICATION; LOGIC CIRCUITS; SOLENOIDS; SUBSTRATES; SUPERCONDUCTING DEVICES; SUPERCONDUCTING FILMS; THICKNESS
Descriptors DEC
DIMENSIONS; ELECTRIC COILS; ELECTRICAL EQUIPMENT; ELECTRONIC CIRCUITS; ENERGY STORAGE SYSTEMS; EQUIPMENT; FILMS; MATERIALS

Optional Information

Secondary number(s)
US patent application 7-755,264.