Thin film superconducting LC network
Description
A thin-film superconducting LC network is described comprising (a) a dielectric substrate having first and second oppositely disposed surfaces, (b) a first thin-film superconducting conductor disposed on one of said first and second surfaces defining an inductor, the substrate having a portion between said first conductor and said second oppositely-disposed surface, said portion having a first thickness, (c) second and third thin-film superconducting conductors disposed on said first and second surfaces, respectively, said second and third conductors opposing each other and having at least another portion of the dielectric substrate therebetween to realize a capacitor, the portion of the substrate between said second and third conductors having a second thickness less than said first thickness, and (d) thin-film superconducting conductor means for interconnecting the first conductor and a preselected one of the second and third conductors, thereby interconnecting the inductor and the capacitor to realize a desired LC network
Availability note (English)
Available from Patent and Trademark Office, Box 9, Washington, DC 20232 (United States).Additional details
Publishing Information
- Imprint Pagination
- [10 p.].
- IPC:
- Int. Cl. H03H 7/01; H01F 5/08.
- IPC
- Int. Cl. H03H 7/01; H01F 5/08.
- Patent number
- US patent document 5,231,078/A/
INIS
- Country of Publication
- United States
- Country of Input or Organization
- United States
- INIS RN
- 25013618
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Resource subtype / Literary indicator
- Non-conventional Literature
- Descriptors DEI
- CAPACITORS; DESIGN; DIELECTRIC MATERIALS; FABRICATION; LOGIC CIRCUITS; SOLENOIDS; SUBSTRATES; SUPERCONDUCTING DEVICES; SUPERCONDUCTING FILMS; THICKNESS
- Descriptors DEC
- DIMENSIONS; ELECTRIC COILS; ELECTRICAL EQUIPMENT; ELECTRONIC CIRCUITS; ENERGY STORAGE SYSTEMS; EQUIPMENT; FILMS; MATERIALS
Optional Information
- Secondary number(s)
- US patent application 7-755,264.