Published September 2005 | Version v1
Journal article Metadata-only

Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition

Creators

  • 1. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001 (China)
  • 2. Yik Shing Tat Industrial Co., Ltd., Shenzhen 518101 (China)

Description

With small amount of Zn addition, a refined microstructure of bulk Sn-0.7Cu solder alloy has been obtained. Meanwhile, retardation effect has been observed on the growth of IMC layer at the solder/Cu joint interface. The composition variation of the interface IMC layer with the amount of Zn addition is reported and thermodynamically analyzed

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2005.05.013;
PII
S1359-6462(05)00315-5;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
53
Journal Issue
6
Journal Page Range
p. 699-702
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
38060171
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
EUTECTICS; INTERFACES; INTERMETALLIC COMPOUNDS; JOINTS; LAYERS; MICROSTRUCTURE; THERMODYNAMICS
Descriptors DEC
ALLOYS

Optional Information

Copyright
Copyright (c) 2005 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.