Published May 19, 2008 | Version v1
Journal article

Effects of hydrogen implantation temperature on InP surface blistering

  • 1. Department of Electrical and Computer Engineering, University of California, San Diego, La Jolla, California 92093 (United States)
  • 2. Los Alamos National Laboratory, Los Alamos, New Mexico 87545 (United States)
  • 3. MATIS-CNR-INFM and Dipartimento di Fisica ed Astronomia, Universita di Catania, Via S. Sofia 64, I-95123 Catania (Italy)
  • 4. Analog and Mixed-Signal Technologies, Freescale Semiconductor Inc., Tempe, Arizona 85284 (United States)

Description

We have investigated the effects of hydrogen implantation temperature on the ion-cut process of InP by examining the correlation between surface blistering and the ion induced damage, hydrogen distribution, and strain. Using Rutherford backscattering spectrometry, elastic recoil detection, and x-ray diffraction, it was found that both the point defects induced by the hydrogen implantation and the in-plane compressive stress were necessary for hydrogen trapping and H-platelet nucleation and growth. The control of implantation temperature is crucial for creating sufficient defects and strain to induce surface blistering or layer exfoliation

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
92
Journal Issue
20
Journal Page Range
p. 202107-202107.3
ISSN
0003-6951
CODEN
APPLAB

Optional Information

Notes
(c) 2008 American Institute of Physics