Published August 16, 1997 | Version v1
Journal article Metadata-only

The determination of the grain boundary width of ultrafine grained copper and nickel from electrical resistivity measurements

Creators

  • 1. Ufa State Aviation Tech. Univ. (Russian Federation). Inst. of Phys. of Adv. Mater.
  • 2. Warsaw Univ. of Technology (Poland). Inst. of Physics
  • 3. Warsaw Univ. (Poland). Dept. of Chemistry

Description

The grain size distribution of copper and nickel processed by severe plastic deformation was studied by transmission electron microscopy. The temperature dependence of electrical resistivity in the temperature range from 20 to 300 K is presented. The tunnel model of electrical resistivity of grain boundaries is discussed. The width of the potential barrier at grain boundaries in copper and nickel is determined. Larger values of potential barriers are noted in ultrafine grained materials in comparison to the crystallographic width of grain boundaries. (orig.)

Additional details

Publishing Information

Journal Title
Physica Status Solidi. A, Applied Research
Journal Volume
162
Journal Issue
2
Journal Page Range
p. 559-566.
ISSN
0031-8965
CODEN
PSSABA

INIS

Country of Publication
Germany
Country of Input or Organization
Germany
INIS RN
28066990
Subject category
S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE;
Descriptors DEI
COPPER; ELECTRIC CONDUCTIVITY; ELECTRON MICROSCOPY; GRAIN BOUNDARIES; GRAIN SIZE; GRANULAR MATERIALS; MICROSTRUCTURE; NICKEL; TEMPERATURE DEPENDENCE; TUNNEL EFFECT
Descriptors DEC
CRYSTAL STRUCTURE; ELECTRICAL PROPERTIES; ELEMENTS; MATERIALS; METALS; MICROSCOPY; PHYSICAL PROPERTIES; SIZE; TRANSITION ELEMENTS