Published June 30, 2014
| Version v1
Journal article
Voltage polarity manipulation of the magnetoresistance sign in organic spin valve devices
Creators
- 1. National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, 22 Hankou Road, Nanjing 210093 (China)
Description
The spin transport in organic spin valve (OSV) devices has been systematically investigated by inserting a low work function material Al between ferromagnetic electrode and organic layer. The resistance and current-voltage curve symmetry are dramatically altered as increasing Al thickness, indicating that an electron-unipolar OSV is obtained. Moreover, the magnetoresistance sign depends on the voltage polarity for certain Al thickness. We attribute this phenomenon to the Fermi and the lowest unoccupied molecular orbits energies of the two electrodes responding to the spin injection and detection, respectively. These findings provide a simple approach to control both the carrier type and the spin direction simultaneously.
Additional details
Identifiers
- DOI
- 10.1063/1.4885770;
Publishing Information
- Journal Title
- Applied Physics Letters
- Journal Volume
- 104
- Journal Issue
- 26
- Journal Page Range
- p. 262402-262402.5
- ISSN
- 0003-6951
- CODEN
- APPLAB
INIS
- Country of Publication
- United States
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 46010066
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- ALUMINIUM; CARRIERS; CONTROL; DETECTION; ELECTRIC CONDUCTIVITY; ELECTRIC POTENTIAL; ELECTRODES; FERROMAGNETIC MATERIALS; INJECTION; LAYERS; MAGNETORESISTANCE; ORGANIC MATTER; SPIN; SYMMETRY; THICKNESS; VALVES; WORK FUNCTIONS
- Descriptors DEC
- ANGULAR MOMENTUM; CONTROL EQUIPMENT; DIMENSIONS; ELECTRIC CONDUCTIVITY; ELECTRICAL PROPERTIES; ELEMENTS; EQUIPMENT; FLOW REGULATORS; FUNCTIONS; INTAKE; MAGNETIC MATERIALS; MATERIALS; MATTER; METALS; PARTICLE PROPERTIES; PHYSICAL PROPERTIES
Optional Information
- Notes
- (c) 2014 AIP Publishing LLC