Published August 2018 | Version v1
Journal article

A comprehensive study of the TiN/Si interface by X-ray photoelectron spectroscopy

  • 1. Instituto de Física "Gleb Wataghin", Universidade Estadual de Campinas, Campinas, SP (Brazil)
  • 2. PGMAT, Universidade de Caxias do Sul, Caxias do Sul, RS (Brazil)

Description

Highlights: • A comprehensive XPS study of the TiN/Si interface bonds formation is presented. • An experimental procedure is shown to minimize oxygen contamination of the interface. • The role of H2 promoting Ti–Si bonds are discussed. • The influence of the substrate preparation on the interface-local bond is proposed. In this paper, a comprehensive X-ray photoelectron spectroscopy (XPS) study of the first atomic layers of TiN nanofilms grown by ion beam assisted deposition on crystalline silicon is reported. This deposition technique allows a fine control of the ion species and energy arriving at the substrate. The substrates are prepared by ion beam cleaning involving Xe+ ion bombardment in different partial pressures of molecular H2. The expected hydrogen passivation effect by the Si–H formation bond limiting the Si–O bonds was quantitatively evaluated and correlated with some retention of H and O at the substrate surface. The effects of molecular H2 and residual H2O atmosphere present during the process on the chemical bonding on both the naked Si substrate and afterward on the interface are reported. A detailed XPS analysis performed in an attached UHV chamber to the preparation chamber of the TiN/Si interface shows that the bombarding cleaning procedure plays an important role in the bond formation at the interface since minute amounts the oxygen jeopardize the bulk properties.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.apsusc.2018.04.005

Additional details

Identifiers

DOI
10.1016/j.apsusc.2018.04.005;
PII
S016943321830953X;

Publishing Information

Journal Title
Applied Surface Science
Journal Volume
448
Journal Page Range
p. 502-509
ISSN
0169-4332
CODEN
ASUSEE

Optional Information

Copyright
Copyright (c) 2018 Elsevier B.V. All rights reserved.