Published February 2019 | Version v1
Journal article

Electrical, mechanical and thermal properties of graphene nanoplatelets reinforced UHMWPE nanocomposites

  • 1. Department of Mechanical Engineering, Khalifa University of Science and Technology, Masdar Campus, Masdar City, P.O. Box 54224, Abu Dhabi (United Arab Emirates)
  • 2. Department of Orthopaedic Surgery, Harvard Medical School, A-111 25 Shattuck Street, Boston (United States)
  • 3. Department of Orthopaedics Surgery, Harris Orthopaedics Laboratory, Massachusetts General Hospital, 55 Fruit St, Boston (United States)

Description

Highlights: • GNP/UHMWPE nanocomposites were prepared by solution mixing followed by compression molding. • The electrical conductivity of GNP/UHMWPE nanocomposites shows percolation threshold at 3.0 wt% of GNP. • The elastic modulus and yield strength increase by 30% and 21%, for the addition of 0.5 wt% and 1.0 wt% of GNP, respectively. • With the addition of 0.1 wt% CNT, lower percolation threshold was achieved for CNT0.1/GNPx/UHMWPE hybrid nanocomposites. -- Abstract: Here, we report the electrical, mechanical and thermal properties of ultrahigh-molecular-weight polyethylene (UHMWPE) nanocomposites reinforced with 0.1 wt% to 10 wt% of graphene nanoplatelets (GNP). The electrical conductivity of GNP/UHMWPE nanocomposites shows percolation threshold at 3.0 wt% of GNP. A significant increase in electrical conductivity from 10−15 S cm−1 for neat UHMWPE to 10−5 S cm−1 at 3.0 wt% GNP loading of GNP/UHMWPE nanocomposite (i.e. 10 orders of magnitude higher) is due to the formation of an almost three-dimensional conductive network. The highest value of electrical conductivity (1.09 S cm−1) is observed at 10.0 wt% of GNP loading. The elastic modulus and yield strength increase by 30% and 21%, for the addition of 0.5 wt% and 1.0 wt% of GNP, respectively, while fracture toughness and the ultimate tensile strength decrease significantly above 0.5 wt% GNP loading. This study demonstrates the fabrication of GNP/UHMWPE bio-nanocomposites, which exhibit electrical properties useful for smart biomedical implants.

Additional details

Identifiers

DOI
10.1016/j.mseb.2019.02.011;
PII
S0921510719300455;

Publishing Information

Journal Title
Materials Science and Engineering. B, Solid-State Materials for Advanced Technology (Print)
Journal Volume
241
Journal Page Range
p. 82-91
ISSN
0921-5107
CODEN
MSBTEK

Optional Information

Copyright
Copyright (c) 2019 Elsevier B.V. All rights reserved.