Published May 2021
| Version v1
Journal article
Nanoscale periodic distribution of energy dissipation at the shear band plane in a Zr-based metallic glass
- 1. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003 (China)
- 2. School of Physical Science and Technology, Shanghai Tech University, Shanghai 201210 (China)
- 3. Institute of Physics, Chinese Academy of Sciences, Beijing 100190 (China)
Description
The local energy dissipation near the shear band plane was characterized by using a method of amplitude-modulation atomic force microscope, in a Cu50Zr50 metallic glass. The shear band plane has higher energy dissipation than the undeformed metallic glass surface. Along the propagating direction of shear bands, the energy dissipation is periodically distributed, arising from density changes and discontinuous growth of the shear offset during the sliding process. Our experimental findings of the fluctuated distribution of energy dissipation at the plane uncover some dynamic information about the shear banding process and explain some key features of shear bands in metallic glasses.
Availability note (English)
Available from http://dx.doi.org/10.1016/j.scriptamat.2021.113784Additional details
Identifiers
- DOI
- 10.1016/j.scriptamat.2021.113784;
- PII
- S1359646221000646;
Publishing Information
- Journal Title
- Scripta Materialia
- Journal Volume
- 197
- Journal Page Range
- vp.
- ISSN
- 1359-6462
- CODEN
- SCMAF7
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 53120067
- Subject category
- S36: MATERIALS SCIENCE;
- Descriptors DEI
- AMPLITUDES; ATOMIC FORCE MICROSCOPY; DENSITY; DISTRIBUTION; ENERGY LOSSES; METALLIC GLASSES; MICROSCOPES; NANOSTRUCTURES; PERIODICITY; SHEAR; SURFACES
- Descriptors DEC
- LOSSES; MICROSCOPY; PHYSICAL PROPERTIES; VARIATIONS
Optional Information
- Copyright
- Copyright (c) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.