Published July 17, 1989 | Version v1
Journal article Metadata-only

Comment on ''Aluminum cladding of high Tc superconductor by thermocompression bonding''

Creators

  • 1. Semiconductor Electronics Division, National Institute of Standards and Technology, Gaithersburg, Maryland 20899 (USA)

Description

This response points out the long history of reliability problems with Ag-Al metallurgical couple and indicates that the proposed system is not likely to be improved without basic metallurgical changes

Additional details

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
55
Journal Issue
3
Series
Appl. Phys. Lett.
Journal Page Range
321
ISSN
0003-6951
CODEN
APPLA

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
20083746
Subject category
S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE; S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM; ALUMINIUM OXIDES; BARIUM OXIDES; BONDING; CLADDING; COATINGS; COMPRESSION; COPPER OXIDES; ELECTRIC CONTACTS; FABRICATION; MIM JUNCTIONS; SILVER; TYPE-II SUPERCONDUCTORS; YTTRIUM OXIDES
Descriptors DEC
ALKALINE EARTH METAL COMPOUNDS; ALUMINIUM COMPOUNDS; BARIUM COMPOUNDS; CHALCOGENIDES; COPPER COMPOUNDS; DEPOSITION; ELECTRICAL EQUIPMENT; ELEMENTS; EQUIPMENT; JOINING; METALS; OXIDES; OXYGEN COMPOUNDS; SEMICONDUCTOR JUNCTIONS; SUPERCONDUCTORS; SURFACE COATING; TRANSITION ELEMENT COMPOUNDS; TRANSITION ELEMENTS; YTTRIUM COMPOUNDS