Published January 1979 | Version v1
Report Restricted

Mechanical integrity of thin films

Creators

  • 1. Case Western Reserve Univ., Cleveland, OH

Description

Mechanical considerations starting with the initial film deposition including questions of adhesion and grading the interface are reviewed. Growth stresses, limiting thickness, stress relief, control aging, and creep are described

Files

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Additional details

Publishing Information

Imprint Title
Thin film problems and research in energy systems
Journal Page Range
p. 49-54.
Report number
CONF-761168--(Summ.)

Conference

Title
ERDA/DPR symposium on thin-film research.
Dates
1 - 3 Nov 1976.
Place
Pacific Grove, CA, USA.

INIS

Country of Publication
United States
Country of Input or Organization
United States
INIS RN
10486994
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
AGING; CREEP; FILMS; MECHANICAL PROPERTIES; STRESS ANALYSIS; SUBSTRATES; SURFACE COATING
Descriptors DEC
DEPOSITION