Electroplating tellurium for 124I production via 124Te or 125Te(p,n)124I reactions

We investigated the 125Te(p, 2n)124I reaction. Tellurium targets were prepared by DC CCE of the metal from alkaline plating solutions. Copper plates coated with nickel were used as target carriers. A copper plate was cleaned using sandpaper (1000) grade followed by rinsing copper plate with deionized water. The copper plate was placed in 1000 mL beaker containing nickel sulphate plating solution. Copper plated was connected to the power supply, as cathode while the platinum electrode is the anode. Power supply was turned on and the current was adjusted to 73 mA.cm-2 and allowed for 3 minutes, giving the nickel-electroplated target. After turning off the power supply, the electrodes were disconnected and rinsed with deionized water and acetone to accelerate drying. TeO2 (3.0 g) was added to a 500 mL flask, followed by KOH (7.5 g) and deionized water (250 mL). Before electroplating, the homogenized solution was filtered through a fine glass filter (0.45 μm) to remove any residual particles (if necessary). The freshly prepared solution of tellurium was poured in the plating vessel. The four outputs of the current boosters were connected to the cathodes by introducing the four block male plugs (nickel coated copper targets). This was followed by the introduction of the electromagnetic stirrer in such a way that the central Pt-anode wire fitted into the hollow stirring cylinder. The rotational speed of the stirrer was 1200 rpm. The electrolysis started by introducing the common output plug of the boosters into the bottom of deposition vessel at 4.2 mA.cm-2. The procedure is a result of optimization with respect to the concentration of KOH and electroplating current