Cryogenic vessel for cooling electronic components

A cryogenic vessel is described for cooling electronic components, the cryogenic vessel comprising: a pair of vessel portions, each having an outer wall and an interior immersion chamber; a membrane member between the vessel portions for separating the immersion chambers, the membrane member having opening means therein for providing fluid transfer between the immersion chambers of the vessel portions and a portion extending from between the vessel portions to a point exterior of the vessel portions; sealing means between the membrane member and each of the vessel portions for providing a fluid tight seal of the immersion chambers; and electronic component mounting means on a portion of the membrane member within the immersion chambers for mounting thereon an electronic component to be cooled