Published September 27, 2010 | Version v1
Journal article

Straining of SiGe ultrathin films with mesoporous Si substrates

  • 1. Institut des Nanotechnologies de Lyon INL-UMR5270, CNRS, INSA de Lyon, Universite de Lyon, Villeurbanne F-69621 (France)
  • 2. Institut des Nanotechnologies de Lyon INL-UMR5270, CNRS, Ecole Centrale de Lyon, Universite de Lyon, Ecully F-69134 (France)
  • 3. Institut des Nanotechnologies de Lyon INL-UMR5270, CNRS, Universite Lyon 1, Universite de Lyon, Villeurbanne F-69622 (France)

Description

We report on the fabrication and characterization of ultrathin (down to 50 nm) tensile strained SiGe films on mesoporous Si substrates. Low temperature oxidation of the porous substrate relaxes the compressive strain in the as grown monocrystalline (mc) SiGe. Applying this method to a 50 nm thick mc-Si0.72Ge0.28 film, a tensile strain >0.78% can be achieved without compromising crystalline quality and up to 1.45 % without the appearance of cracks.

Additional details

Identifiers

Publishing Information

Journal Title
Applied Physics Letters
Journal Volume
97
Journal Issue
13
Journal Page Range
p. 131910-131910.3
ISSN
0003-6951
CODEN
APPLAB

Optional Information

Notes
(c) 2010 American Institute of Physics