Published August 2012 | Version v1
Journal article

Modeling of silicon thermal expansion using strained phonon spectra

  • 1. Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096 (China)

Description

Based on lattice dynamics theories, a model has been developed to examine the thermal expansion of crystalline silicon. The thermal expansion coefficient α of crystalline silicon has been extracted by using the strained phonon spectra. It is found to be 2.49 × 10−6 K−1 at room temperature. Based on the temperature dependence of second-order elastic constants and Raman scattering, a semiempirical model for the thermal expansion coefficient of crystalline silicon as a function of temperature has been presented. The obtained results are in good agreement with available experimental data, and the average deviation of thermal expansion coefficient from experiments is less than 2.4%. (paper)

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/22/8/085007

Additional details

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
22
Journal Issue
8
Journal Page Range
[6 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
47054043
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
PHONONS; RAMAN EFFECT; SILICON; SIMULATION; SPECTRA; STRAINS; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0273-0400 K; THERMAL EXPANSION
Descriptors DEC
ELEMENTS; EXPANSION; QUASI PARTICLES; SEMIMETALS; TEMPERATURE RANGE