Published August 2012
| Version v1
Journal article
Modeling of silicon thermal expansion using strained phonon spectra
- 1. Key Laboratory of MEMS of the Ministry of Education, Southeast University, Nanjing 210096 (China)
Description
Based on lattice dynamics theories, a model has been developed to examine the thermal expansion of crystalline silicon. The thermal expansion coefficient α of crystalline silicon has been extracted by using the strained phonon spectra. It is found to be 2.49 × 10−6 K−1 at room temperature. Based on the temperature dependence of second-order elastic constants and Raman scattering, a semiempirical model for the thermal expansion coefficient of crystalline silicon as a function of temperature has been presented. The obtained results are in good agreement with available experimental data, and the average deviation of thermal expansion coefficient from experiments is less than 2.4%. (paper)
Availability note (English)
Available from http://dx.doi.org/10.1088/0960-1317/22/8/085007Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Micromechanics and Microengineering. Structures, Devices and Systems
- Journal Volume
- 22
- Journal Issue
- 8
- Journal Page Range
- [6 p.]
- ISSN
- 0960-1317
- CODEN
- JMMIEZ
INIS
- Country of Publication
- United Kingdom
- Country of Input or Organization
- International Atomic Energy Agency (IAEA)
- INIS RN
- 47054043
- Subject category
- S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
- Descriptors DEI
- PHONONS; RAMAN EFFECT; SILICON; SIMULATION; SPECTRA; STRAINS; TEMPERATURE DEPENDENCE; TEMPERATURE RANGE 0273-0400 K; THERMAL EXPANSION
- Descriptors DEC
- ELEMENTS; EXPANSION; QUASI PARTICLES; SEMIMETALS; TEMPERATURE RANGE