Published October 2021 | Version v1
Journal article

Reveal the stacking fault shearing mechanism by its annihilation process in Ni-based single crystal superalloys

  • 1. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an, 710072 (China)

Description

Highlights: • The stacking fault shearing mechanism was revealed by a designed experiment. • The stacking fault would shrink and be transformed into a dislocation pair during high-temperature annealing. • Burgers vectors of the dislocation pair were characterized and identified using a series of two-beam conditions. Based on the reversibility of stacking fault formation, the annihilation process during annealing was characterized to reveal the stacking fault shearing mechanism in Ni-based single crystal superalloys. After the creep rupture test at 750 °C/750 MPa, lots of stacking faults would be created in γ' precipitates. Further annealing at 1000 °C for 4 h, these stacking faults would shrink and were transformed into dislocation pairs containing two a/2 110 dislocation with different Burgers vectors. Finally, the stacking fault shearing mechanism could be clarified as:a/21¯01+a/201¯1a/31¯1¯2+SF+a/61¯1¯2.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.matchar.2021.111419

Additional details

Identifiers

DOI
10.1016/j.matchar.2021.111419;
PII
S1044580321005416;

Publishing Information

Journal Title
Materials Characterization
Journal Volume
180
Journal Page Range
vp.
ISSN
1044-5803
CODEN
MACHEX

INIS

Country of Publication
United States
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
54086897
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
BURGERS VECTOR; DESIGN; DISLOCATIONS; HEAT RESISTING ALLOYS; MONOCRYSTALS; PRECIPITATION; RUPTURES; STACKING FAULTS
Descriptors DEC
ALLOYS; CRYSTAL DEFECTS; CRYSTAL STRUCTURE; CRYSTALS; FAILURES; HEAT RESISTANT MATERIALS; LINE DEFECTS; MATERIALS; SEPARATION PROCESSES

Optional Information

Copyright
Copyright (c) 2021 Elsevier Inc. All rights reserved.