Published October 2010 | Version v1
Journal article

A micromolded connector for reconfigurable millirobots

  • 1. Department of Mechanical Engineering, University of California, Berkeley, CA 94720 (United States)
  • 2. Department of Electrical Engineering and Computer Science, University of California, Berkeley, CA 94720 (United States)

Description

We have developed a micromolded connector for applications such as folded millirobots where reusability, low engaged profile and rapid assembly are required. Using laser micromachining and micromolding techniques, the microconnector is formed with a manufacturing process that can be integrated with the rapid prototyping of the millirobots. The microconnector engages through shear in one direction while forming a strong connection in orthogonal directions, with an engaged thickness of 200 µm. The microconnectors have been shown to be strong in the shear and normal pull-off directions with strengths of 42 and 27 N cm−2, respectively, as well as being robust to shear failure, maintaining over 65% of their strength after being run to failure ten times. Due to the anisotropic property of the microconnector, it can also be rapidly engaged and disengaged repeatedly in the release direction without degrading the connector strength. The microconnectors have also been successfully integrated into various millirobots for quick appendage changes, showing their applicability to millirobots

Availability note (English)

Available from http://dx.doi.org/10.1088/0960-1317/20/10/105011

Additional details

Identifiers

DOI
10.1088/0960-1317/20/10/105011;
PII
S0960-1317(10)57049-9;

Publishing Information

Journal Title
Journal of Micromechanics and Microengineering. Structures, Devices and Systems
Journal Volume
20
Journal Issue
10
Journal Page Range
[11 p.]
ISSN
0960-1317
CODEN
JMMIEZ

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46013213
Subject category
S75: CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY;
Descriptors DEI
EFFICIENCY; ELECTRONIC EQUIPMENT; MANUFACTURING; MICROSTRUCTURE; ROBOTS
Descriptors DEC
EQUIPMENT