Published March 26, 2014 | Version v1
Journal article

Fatigue crack growth behavior of Al–Mg–Sc alloy

  • 1. School of Materials Science and Engineering, Central South University, Changsha 410083 (China)
  • 2. The Key Laboratory of Nonferrous Materials Science and Engineering of Ministry of Education, Central South University, Changsha 410083 (China)

Description

The Al–Mg–Sc alloy sheets were prepared using water chilling copper mold ingot metallurgy processing which was protected by active flux. The microstructure and mechanical properties of the Al–Mg–Sc alloy were studied by means of transmission electron microscopy (TEM), scanning electron microscopy (SEM), optical microscopy (OM) and tensile and fatigue crack growth (FCG) rate tests. The FCG rate (da/dN) with stress intensity factor range (ΔK) was discussed within the Paris region. The Al–Mg–Sc alloy exhibited high resistance against fatigue crack growth, and the second phase of Al3(Sc1−xZrx) was found to be the main factor influencing the FCG resistance

Availability note (English)

Available from http://dx.doi.org/10.1016/j.msea.2014.01.045

Additional details

Identifiers

DOI
10.1016/j.msea.2014.01.045;
PII
S0921-5093(14)00076-8;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
598
Journal Page Range
p. 350-354
ISSN
0921-5093
CODEN
MSAPE3

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
46047651
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
ALUMINIUM ALLOYS; COPPER; CRACK PROPAGATION; FATIGUE; FUNGI; METALLURGY; MICROSTRUCTURE; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; STRESS INTENSITY FACTORS; TRANSMISSION ELECTRON MICROSCOPY
Descriptors DEC
ALLOYS; ELECTRON MICROSCOPY; ELEMENTS; MECHANICAL PROPERTIES; METALS; MICROSCOPY; PLANTS; TRANSITION ELEMENTS

Optional Information

Copyright
Copyright (c) 2014 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.