Published October 2019 | Version v1
Journal article

Slip and fracture behavior of δ-Ni3Nb plates in a polycrystalline nickel-based superalloy during fatigue

  • 1. School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, PR (China)
  • 2. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi'an 710072, PR (China)
  • 3. Instrumental Analysis Center, Shanghai Jiao Tong University, Shanghai 200240, PR (China)
  • 4. Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming, Shanghai Jiao Tong University, Shanghai 200240, PR (China)

Description

The fatigue deformation behavior of δ-Ni3Nb (D0a intermetallic phase in nickel-based superalloy) was analyzed in detail to determine its fracture characteristics and possible slip systems. Strong arrangement-dependence (i.e. arrangement direction of plate length relative to loading direction) deformation characteristics were observed. When δ plates were arranged not paralleling to the loading direction, they exhibited certain degree of fatigue resistance. Slip traces were found in the non-parallel δ plates after some fatigue cycles. By analyzing the traces and habit plane of δ, the possible operative slip systems were confirmed to be (010)δ[100]δ and (010)δ[102]δ.

Additional details

Identifiers

DOI
10.1016/j.scriptamat.2019.06.013;
PII
S1359646219303458;

Publishing Information

Journal Title
Scripta Materialia
Journal Volume
171
Journal Page Range
p. 36-41
ISSN
1359-6462
CODEN
SCMAF7

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
55043193
Subject category
S36: MATERIALS SCIENCE;
Descriptors DEI
DEFORMATION; FRACTURES; HABIT PLANES; HEAT RESISTING ALLOYS; INTERMETALLIC COMPOUNDS; NICKEL; PLATES; POLYCRYSTALS
Descriptors DEC
ALLOYS; CRYSTALS; ELEMENTS; FAILURES; HEAT RESISTANT MATERIALS; MATERIALS; METALS; TRANSITION ELEMENTS

Optional Information

Copyright
Copyright (c) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.