Multi Chip Modules technologies

In the past few years, impressive progresses in electronic devices and their packaging have been achieved. High energy physicists benefit from this, being able to minimise the amount of material in their Vertex-Detectors. Although the environment of Vertex-Detectors is much more controlled and stabilised than in the industry- or end-user-applications, the requirements of material-budget and device complexity are higher. This paper tries to give a short overview of the existing Multi Chip Module technologies used in Vertex-Detectors and focuses on the prototyping results of an upcoming Multi Chip Module technology, called Multi Chip Module-Deposited (MCM-D), as it is planned to be used for the innermost part of the ATLAS Pixel detector