Published July 1, 2011 | Version v1
Journal article

Characterization of Plasma Enhanced Chemical Vapor Deposition-Physical Vapor Deposition transparent deposits on textiles to trigger various antimicrobial properties to food industry textiles

  • 1. Universite de Lyon, Universite Lyon 1, Laboratoire des Sciences Analytiques (LSA), CNRS, UMR 5180, Bat. J. Raulin 5eme etage, F-69622 Villeurbanne Cedex (France)
  • 2. Universite de Lyon, Universite Lyon 1, Laboratoire de Recherche en Genie Industriel Alimentaire (LRGIA, E.A. 3733), Rue Henri de Boissieu, F-01000 Bourg en Bresse (France)
  • 3. Science et Surface, 64, Chemin des Mouilles, F-69130 Ecully (France)
  • 4. HEF, ZI SUD, Rue Benoit Fourneyron, F-42166 Andrezieux Boutheon (France)
  • 5. TDV Industrie, 43 Rue du Bas des Bois, BP 121, F-53012 Laval Cedex (France)

Description

Textiles for the food industry were treated with an original deposition technique based on a combination of Plasma Enhanced Chemical Vapor Deposition and Physical Vapor Deposition to obtain nanometer size silver clusters incorporated into a SiOCH matrix. The optimization of plasma deposition parameters (gas mixture, pressure, and power) was focused on textile transparency and antimicrobial properties and was based on the study of both surface and depth composition (X-ray Photoelectron Spectroscopy (XPS), Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS), as well as Transmission Electron Microscopy, Atomic Force Microscopy, SIMS depth profiling and XPS depth profiling on treated glass slides). Deposition conditions were identified in order to obtain a variable and controlled quantity of ∼ 10 nm size silver particles at the surface and inside of coatings exhibiting acceptable transparency properties. Microbiological characterization indicated that the surface variable silver content as calculated from XPS and ToF-SIMS data directly influences the level of antimicrobial activity.

Availability note (English)

Available from http://dx.doi.org/10.1016/j.tsf.2011.02.062

Additional details

Identifiers

DOI
10.1016/j.tsf.2011.02.062;
PII
S0040-6090(11)00591-8;

Publishing Information

Journal Title
Thin Solid Films
Journal Volume
519
Journal Issue
18
Journal Page Range
p. 5838-5845
ISSN
0040-6090
CODEN
THSFAP

Optional Information

Copyright
Copyright (c) 2011 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.