Published July 15, 2004 | Version v1
Journal article

Solidification behaviour of undercooled Co-Cu alloys showing a metastable miscibility gap

Description

Co-Cu exhibits a metastable miscibility gap: Upon undercooling below the binodal the melt separates into the Co-rich L1-phase and the Cu-rich L2-phase. The solidification behaviour and the solidified structure of the Co-rich L1-phase is in the focus of the present work. High values of undercooling are achieved by using the method of containerless processing in an electromagnetic levitation facility (EML), the metastable states are frozen in instantaneously and are studied by scanning electron microscopy. The solidification velocity of the primary solidifying Co-rich L1-phase has been measured. A transition in microstructure of the solidified Co-rich L1-phase has been found, while at lower and intermediate undercooling Co-rich dendrites are formed, an irregular structure is dominating at higher undercooling. The results can be described within the Galenko-Danilov model for dendritic solidification

Additional details

Identifiers

DOI
10.1016/j.msea.2003.10.121;
PII
S0921509303011456;

Publishing Information

Journal Title
Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing
Journal Volume
375-377
Journal Issue
1-2
Journal Page Range
p. 520-523
ISSN
0921-5093
CODEN
MSAPE3

Conference

Title
11. international conference on rapidly quenched and metastable materials
Dates
25-30 Aug 2002
Place
Oxford (United Kingdom)

INIS

Country of Publication
Netherlands
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
37059792
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Conference
Descriptors DEI
ALLOYS; DENDRITES; LEVITATION; METASTABLE STATES; MICROSTRUCTURE; PROCESSING; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; SOLUBILITY; SUBCOOLING
Descriptors DEC
COOLING; CRYSTALS; ELECTRON MICROSCOPY; ENERGY LEVELS; EXCITED STATES; MICROSCOPY; PHASE TRANSFORMATIONS

Optional Information

Copyright
Copyright (c) 2003 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.