Published December 2008
| Version v1
Journal article
Analysis and correction of carrier spilling effect for different Si structures
Creators
- 1. ON Semiconductor Slovakia, a.s., 921 01 Piestany (Slovakia)
- 2. Slovak University of Technology, Faculty of Electrical Engineering, Department of Microelectronics, 81219 Bratislava (Slovakia)
Description
In this article we present a method for basic correction of carrier concentration profiles measured by the spreading resistance technique for the carrier spilling effect. It is shown how to calculate carrier distribution on the bevelled surface and what is the effect of the bevel on the distribution of free charge carriers. We also present how carrier spilling affects different silicon structures and whether the so-called zero field correction is sufficient. This is done on several typical silicon structures used in semiconductor technology. For comparison we used SIMS ND(x) profiles and theoretical Nt(x) profiles simulated by DIOS. (authors)
Additional details
Identifiers
Publishing Information
- Journal Title
- Journal of Electrical Engineering
- Journal Volume
- 59
- Journal Issue
- 6
- Journal Page Range
- p. 302-309
- ISSN
- 1335-3632
INIS
- Country of Publication
- Slovakia
- Country of Input or Organization
- Slovakia
- INIS RN
- 41083544
- Subject category
- S36: MATERIALS SCIENCE;
- Resource subtype / Literary indicator
- Numerical Data
- Descriptors DEI
- BORON IONS; COMPUTER CODES; COMPUTERIZED SIMULATION; EXPERIMENTAL DATA; ION IMPLANTATION; ION MICROPROBE ANALYSIS; MASS SPECTROSCOPY; PENETRATION DEPTH; PHOSPHORUS IONS; SEMICONDUCTOR MATERIALS
- Descriptors DEC
- CHARGED PARTICLES; CHEMICAL ANALYSIS; DATA; INFORMATION; IONS; MATERIALS; MICROANALYSIS; NONDESTRUCTIVE ANALYSIS; NUMERICAL DATA; SIMULATION; SPECTROSCOPY
Optional Information
- Contract/Grant/Project number
- Projects SRDA-VVCE-0049-07; Vega-1/3111/06 and APVV-20-055405
- Notes
- 11 figs.; 11 refs.