Published December 2008 | Version v1
Journal article

Analysis and correction of carrier spilling effect for different Si structures

  • 1. ON Semiconductor Slovakia, a.s., 921 01 Piestany (Slovakia)
  • 2. Slovak University of Technology, Faculty of Electrical Engineering, Department of Microelectronics, 81219 Bratislava (Slovakia)

Description

In this article we present a method for basic correction of carrier concentration profiles measured by the spreading resistance technique for the carrier spilling effect. It is shown how to calculate carrier distribution on the bevelled surface and what is the effect of the bevel on the distribution of free charge carriers. We also present how carrier spilling affects different silicon structures and whether the so-called zero field correction is sufficient. This is done on several typical silicon structures used in semiconductor technology. For comparison we used SIMS ND(x) profiles and theoretical Nt(x) profiles simulated by DIOS. (authors)

Additional details

Publishing Information

Journal Title
Journal of Electrical Engineering
Journal Volume
59
Journal Issue
6
Journal Page Range
p. 302-309
ISSN
1335-3632

INIS

Country of Publication
Slovakia
Country of Input or Organization
Slovakia
INIS RN
41083544
Subject category
S36: MATERIALS SCIENCE;
Resource subtype / Literary indicator
Numerical Data
Descriptors DEI
BORON IONS; COMPUTER CODES; COMPUTERIZED SIMULATION; EXPERIMENTAL DATA; ION IMPLANTATION; ION MICROPROBE ANALYSIS; MASS SPECTROSCOPY; PENETRATION DEPTH; PHOSPHORUS IONS; SEMICONDUCTOR MATERIALS
Descriptors DEC
CHARGED PARTICLES; CHEMICAL ANALYSIS; DATA; INFORMATION; IONS; MATERIALS; MICROANALYSIS; NONDESTRUCTIVE ANALYSIS; NUMERICAL DATA; SIMULATION; SPECTROSCOPY

Optional Information

Contract/Grant/Project number
Projects SRDA-VVCE-0049-07; Vega-1/3111/06 and APVV-20-055405
Notes
11 figs.; 11 refs.