Published February 2010 | Version v1
Journal article

Photogrammetric recession measurements of ablative materials in arcjets

  • 1. NASA Ames Research Center, Moffett Field, CA 94035 (United States)

Description

This paper describes an optical method for measuring the recession time histories of ablative thermal protection system (TPS) materials as they are tested in an arcjet facility. The method is non-intrusive and requires no external light source or modifications to the test article. It does require, first, a test article that exhibits texture as it ablates, and, second, high-resolution video images of the ablating surface from at least two directions. Software automatically reads the sequences of images and, by successive image cross correlation, tracks the deformation of a surface grid that conforms to the shape of the test article. Standard photogrammetric transformations are used to convert image-plane displacements of the surface grid to object-space displacements. The method yields a time history of the displacement of each node of the grid for the full time that the test article is exposed to the arcjet flow. Measurements have been made during many tests in the 60 MW arcjet at NASA Ames Research Center, including tests of TPS materials for the Orion Crew Exploration Vehicle and Mars Science Laboratory. The photogrammetric recession measurements have been in good agreement with post-test measurements of the change in thickness of the test articles

Availability note (English)

Available from http://dx.doi.org/10.1088/0957-0233/21/2/025304

Additional details

Identifiers

DOI
10.1088/0957-0233/21/2/025304;
PII
S0957-0233(10)34339-6;

Publishing Information

Journal Title
Measurement Science and Technology
Journal Volume
21
Journal Issue
2
Journal Page Range
[15 p.]
ISSN
0957-0233
CODEN
MSTCEP

INIS

Country of Publication
United Kingdom
Country of Input or Organization
International Atomic Energy Agency (IAEA)
INIS RN
45005302
Subject category
S46: INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY;
Descriptors DEI
DEFORMATION; GRIDS; IMAGES; LIGHT SOURCES; MATERIALS; SAFETY; SURFACES; THICKNESS
Descriptors DEC
DIMENSIONS; ELECTRODES; RADIATION SOURCES