Fabrication of textured Ni–9.3at.%W substrate by electropulsing intermediate annealing method

Highlights: •It's the first time that EIA is used on Ni9 W substrate production. •Compared with CIA, EIA trends to sharpen the rolling texture. •Improved cube recrystallization texture is obtained by EIA. •EIA provides a highly efficient approach for Ni9 W substrate manufacture. -- Abstract: Sharp cube texture is difficult to obtain in high W content Ni–W alloy substrates used for coated conductors. In this paper, a new method called electropulsing intermediate annealing (EIA) is adopted to optimize the rolling and recrystallization texture of Ni–9.3 at.%W substrate. It is found that, compared with conventional intermediate annealing (CIA) at the same temperature, EIA trends to increase the Copper, S and Brass components, suppress the Goss component in rolling texture. Higher cube recrystallization texture is obtained at relatively low temperature by EIA in a shorter time. The effect of EIA on texture is attributed to the enhancement of recovery process resulting from the athermal effects